KM ACC 250

KM ACC 250 - A substance that removes excess tin salts on the plastic surface after the palladium film forming process.
Application:

• KM ACC 250 is used to remove excess tin from plastic surface after palladium film forming process.
• KM ACC 250 is applied to the plating process on PC and ABS plastic, specifically after the palladium film forming process.
• KM ACC 250 is widely used in factories from small-scale manual to semi-automatic and fully automatic.

Advantages:

• KM ACC 250 removes excess tin from the plastic surface after the palladium film forming process to help the subsequent plating process to be plated evenly and more tightly.
• KM ACC 250 helps promote membrane activation.
• KM ACC 250 removes excess tin from the zig holder to avoid plating on the zig holder to save chemicals.
• KM ACC 250 has low new phase content to save costs.
• KM ACC 250 has 1 component so additional use is also easy.

Contact:

MITEK TECHNOLOGY SOLUTION JOINT STOCK COMPANY
Hanoi office address: S02 - D'Eldorado Building 1, 659A Lac Long Quan, Xuan La Ward, Tay Ho District, Hanoi City
HCM office address: 26 Street No.5 ,Van Phuc 1,Hiep Binh Ward, Ho Chi Minh City.
Website: http://en.mitekvn.com/
Fanpage: https://www.facebook.com/mitekchemicals
Hotline in Hanoi area: 0989.491.366 or 0869.382.925
Hotline in HCM area: 0963.867.366 or 0969.678.756